tlwf1109(t11) 2010-06-03 1 toshiba led lamp tlwf1109(t11) panel circuit indicators ? 3.5 (l) mm 2.9 (w) mm 1.9 (h) mm ? led chip and phosphor ? luminous intensity: i v = 3200 mcd (typ.) @ i f = 40 ma ? color: white ? topr / tstg = -40 to 100c ? high current driving : i f = 50 ma (max) ? standard embossed tape packing: 4 mm pitch: t11 type (2000 pcs/reel) 8-mm tape/ reel ? applications: automotive use, backlighting etc. color and material absolute maximum ratings (ta = 25c) characteristics symbol rating unit forward current (note 1) i f 50 ma power dissipation p d 200 mw operating temperature t opr ? 40 to 100 c storage temperature t stg ? 40 to 100 c note: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operat ing temperature/current/voltage, etc. ) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). note 1: forward current derating unit: mm jedec D jeita D toshiba 4-3w1 weight: 0.035 g (typ.) part number color material tlwf1109 white ingan i f ? ta ambient temperature ta (c) allowable forward current i f (ma) 0 80 60 0 100 80 120 40 20 40 20 60 optoelectronics marktech for part availability and ordering info rmation please call to ll free: 800.984.5337 website: www.marktechopto.com | email: info@marktechopto.com
tlwf1109(t11) 2010-06-03 2 0.2 0.25 0.3 0.35 0.4 0.2 0.25 0.3 0.35 0.4 cx cy electrical characteristics (ta = 25c) characteristics symbol test condition min typ. max unit forward voltage v f i f = 40 ma 3.0 3.5 4.0 v reverse voltage v r i r = 1 ma ? 0.75 ? v optical characteristics (ta = 25c) characteristics symbol test condition min typ. max unit c x i f = 40 ma (note 2) ? chromaticity c y i f = 40 ma (note 2) ? luminous intensity (note 3) i v i f = 40 ma 2000 3200 5000 mcd note 2: the product is tested at the following chromaticity coordinate groups. note 3: iv rank classification test conditions: ta = 25 c luminous intensity i v product name min typ. max i f tlwf1109(t11) 2000 3200 5000 xa2 2000 ? 3200 ya1 2500 ? 4000 ya2 3200 ? 5000 40 unit mcd ma the specification on the above table is used for iv classification of leds in toshiba facility. let the delivery ratio of each rank be unquestioned. a0 cx 0.280 0.296 0.283 0.264 cy 0.248 0.276 0.305 0.267 b5 cx 0.296 0.311 0.307 0.287 cy 0.276 0.294 0.315 0.295 b6 cx 0.311 0.330 0.330 0.307 cy 0.294 0.318 0.339 0.315 accurac y : +/-0.01 a0 b5 b6
tlwf1109(t11) 2010-06-03 3 the cautions when handling this led, take the following measures to prevent the led from being damaged or otherwise adversely affected. 1) use a conductive tablemat and conductive floor mat, and ground the workbench and floor. 2) operators handling laser diodes must be grounded via a high resistance (about 1 m ). a conductive strap is good for this purpose. 3) ground all tools including soldering irons. this product is designed as a general display light s ource usage, and it has appli ed the measurement standard that matched with the sensitivity of hum an's eyes. therefore, it is not int ended for usage of functional application (ex. light source for sensor, optical communication and etc) except general display light source.
tlwf1109(t11) 2010-06-03 4 tlwf1109 ta = 25c 30 0 60 90 90 30 60 1.0 0.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 cx, cy ? i f (typ.) i v /i v (40 ma) ? i f (typ.) 0.01 1 300 30 100 3 10 0.03 0.1 0.3 1 3 5 50 500 ta = 25c i f ? v f (typ.) 1 3 10 30 100 2.2 2.6 3.0 3.4 3.8 4.2 4.6 5.0 ta = 25c -40 -20 0 20406080100 10 1 0.1 forward current i f (ma) i v /i v (40 ma) relative i v ? tc (typ.) chromaticity cx, cy relative luminous intensity i v case temperature tc (c) forward current i f (ma) wavelength characteristic (typ.) relative luminous intensity wavelength (nm) radiation pattern (typ.) forward voltage v f (v) forward current i f (ma) 0.28 0 10 20 30 40 50 0.29 0.30 0.31 0.32 0.33 c y ta = 25c c x 0 300 400 500 600 700 800 0.2 0.4 0.6 0.8 1.0
tlwf1109(t11) 2010-06-03 5 packaging this led device is packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture absorption. the optical characteristics of the device may be affected by exposure to moisture in the air before soldering and the device should therefore be stored under the following conditions: 1. this moisture proof bag may be stored unopene d within 12 months at the following conditions. temperature: 5 c to 30 c humidity: 90% (max) 2. after opening the moisture proof bag , the device should be assembled with in 4weeks in an environment of 5c to 30c/60% rh or below. 3. if upon opening, the moisture in dicator card shows humidity 30% or above (color of indication changes to pink) or the expiration date has passed, the de vice should be baked in taping with reel. after baking, use the baked device within 72 hours, but perform baking only once. baking conditions: 60 5c, for 24 to 48 hours. expiration date: 12 months from sealing date, which is imprinted on the label affixed. 4. repeated baking can cause the pee ling strength of the taping to change , then leads to trouble in mounting. 5. if the packing material of laminate would be broken , the hermeticity would deteriorate. therefore, do not throw or drop the packed devices. mounting method soldering ? reflow soldering (example) ? the product is evaluated using above re flow soldering conditions. no addition al test is performed exceed the condition (i.e. the condition more than max(*) values) as a evaluation. please perf orm reflow soldering under the above conditions. ? please perform the first reflow soldering with referenc e to the above temperature pr ofile and within 4weeks of opening the package. ? second reflow soldering in case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions. storage conditions before the second reflow soldering: 30 c, 60% rh (max) ? make any necessary soldering corrections manually. (only once at each soldering point) soldering iron : 25 w temperature : 300 c or less time : within 3 s ? do not perform wave soldering. 60~120 s 10 s max 240 c max 4 c/s max 140~160 c 4 c/s max time (s) package surface temperature ( c) temperature profile for pb soldering (example) time (s) package surface temperature ( c) temperature profile for pb-free soldering (example) 150~180 c 4 c/s max 5 s max 260 c max 4 c/s max 230 c 60~120 s (*) (*) (*) (*) (*) (*) (*) (*) max (*) max (*) max (*) 30~50s max (*) max (*)
tlwf1109(t11) 2010-06-03 6 recommended soldering pattern cu area > 16 mm 2 4.0 1.1 4.0 unit: mm 4.0 1.5 2.3 0.8 0.7 cathode anode do not use this area for electrical contact. do not use this area for electrical contact.
tlwf1109(t11) 2010-06-03 7 cleaning when cleaning is required after soldering, toshiba recommends the following cleaning solvents. it is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the recommended conditions). in selecting the one for your actual usage, please perform sufficient review on washing condition, us ing condition and etc. asahi clean ak-225aes : (made by asahi glass) kao clean through 750h : (made by kao) pine alpha st-100s : (made by arakawa chemical) precautions when mounting do not apply force to the plastic part of the led under high-temperature conditions. to avoid damaging the led plastic, do not apply friction using a hard material. when installing the pcb in a product, ensure that the device does not come into contact with other cmponents. for this product, silicone is used as the encapsulated material. therefore the top surface of this product is soft. please do not stress on the encapsulated part of leds to avoid affecting the reliability of the product. when using the mounting devices, please use the picking up nozzle that does not affect the silicone resin. tape specifications 1. product number format the type of package used for shipment is denote d by a symbol suffix after the product number. the method of classification is as below. (this method, however does not apply to products whose electrical characteristics differ from standard toshiba specifications) (1) tape type: t11 (4-mm pitch) (2) example 2. tape dimensions unit: mm symbol dimension tolerance symbol dimension tolerance d 1.5 +0.1/?0 p 2 2.0 0.05 e 1.75 0.1 w 8.0 0.3 p 0 4.0 0.1 p 4.0 0.1 t 0.3 0.05 a 0 2.9 0.1 f 3.5 0.05 b 0 3.7 0.1 d 1 1.5 0.1 k 0 2.3 0.1 tlwf1109 (t11) tape type toshiba product no. a 0 p d 1 f e w polarity t k 0 b 0 d p 2 p 0
tlwf1109(t11) 2010-06-03 8 3. reel dimensions unit: mm 4. leader and trailer sections of tape note1: empty trailer section note2: empty leader section 9 +1/?0 180 +0 ?4 60 13 11.4 1.0 2 0.5 44 (note 1) leading part: 190 mm (min) 40 mm or more (note 2) 40 mm or more
tlwf1109(t11) 2010-06-03 9 5. packing form (1) packing quantity reel 2,000 pcs carton 10,000 pcs (2) packing form: each reel is sealed in an aluminum pack with silica gel. 6. label format (1) label contents shipped products are mentioned the following contents. p/n: toshiba type tlwf1109 addc (t11) q?ty 2,000 pcs lot number key code for tsb 32c 2000 (rank symbol) use under 5-30degc/60%rh within 4weeks sealed: [[g]]/rohs compatible diffused in ***** *y380xxxxxxxxxxxxxxxxxx* assembled in ***** (2) label location tape feel direction label position label position ? reel ? carton ? the aluminum package in which the reel is supplied also has the label attached to center of one side.
tlwf1109(t11) 2010-06-03 10 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the ?toshiba semiconductor reliability handbook? and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? a bsent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.
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